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Total Moment* Max. BM Under Including Max. Lane Second Wheel Governing Truck Shear/Reaction (Kip-Ft) (Kip-Ft) (Kips) 390.26 448.26 510.26 576.26 646.26 720.26 798.26 880.26 966.26 1056.26 1150.26 1215.26 1335.76 1460.26 1588.76 1721.26 1857.76 1998.26 2142.76 2291.26 2443.76 2600.26 22.4 24 25.6 27.2 28.8 30.4 32 33.6 35.2 36.8 38.4
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into a liquid plastic and laid out to dry. Both of these techniques, and more, are used to protect the circuit and to displace excess heat from the hybrid assembly. A completed hybrid will take advantage of different circuit construction techniques, such as thin- and thick-film resistors (which can be printed and trimmed directly on the hybrid s substrate), SMD IC chips, SMD capacitors, flip-chips, trace coils, and microstrip transmission lines. In fact, hybrid manufacture is basically a method of constructing a circuit on a specialized PCB by employing any desired electronics technology that is available so that we may decrease both the size and the cost of a circuit, while increasing reliability and performance. Most of the actual ICs placed on a hybrid board are in their unpackaged form, even though many hybrids can and do use packaged SMD ICs. But the ability to exploit ICs in their bare die form means that the size and cost of the entire hybrid circuit can be significantly improved. The bare die is first attached to the hybrid PCB with an epoxy that is optimized for thermal conductivity and/or electrical conductivity, or the epoxy may insulate the bare chip both thermally and electrically from the PCB, depending on the application. The chip s bond wires are attached to the hybrid PCB s metallization layer by a wire-bonding process. This process will rely on the type of bonding wire used out of the bare die. Gold wires require thermosonic bonding, while aluminum wire will need an ultrasonic procedure. Both methods demand a special machine that utilizes a chiseled point that contacts the wire, pressing it against the board s surface metallization while vibrating at ultrasonic frequencies. Thermosonic bonding for gold wires, as its name implies, also adds heat to this process. A superior bare die attachment technique does not use wire bonding at all and obtains much decreased inductive effects. Instead, small solder balls are attached to the IC s connection points. The chip, now called a flip-chip, is affixed to the board by turning the IC chip over so that its solder balls are in contact with the pads of the board s metallization layer. The entire assembly is then heated, causing the flip-chip to be permanently melded to the PCB, both mechanically and electrically. There are other methods of attaching a bare die to a PCB, such as tape automatic bonding and adhesive-bonded microbumps. For more detailed information on these processes, consult Hybrid Microelectronics Handbook by Sergent and Harper. All of the other SMT components, such as the transistors, packaged RFICs, capacitors, resistors, and inductors, can be attached to the substrate s metallization layer by the reflow soldering process, which employs a solder paste that is printed onto the PCB and heated, causing the solder to reflow, electrically and mechanically connecting the components to the board.
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high-speed digital circuit on a wireless board should run only near the PCB s digital ground plane to minimize the current loop area, and thus decrease loop emissions and stray electromagnetic pickup. Tracks should be properly terminated into 50 ohms to minimize reflections and, if these traces are over 2 inches per nanosecond long, then 50-ohm microstrip should be adopted (the maximum track length, in millimeters, should not be more than 46 times the fastest rise or fall time, in nanoseconds, to avoid transmission line effects). If the proper tracks are not employed, or the correct terminations are not used, then ringing and stair stepping of the digital waveform will be created, as well as antenna-like effects (causing EMI). Even when utilizing microstrip, minimize vias along the microstrip to avoid adding capacitance, which lowers the track s impedance, causing delays, a higher VSWR, and reflections. Any stub (a short length of copper trace) situated off the main signal track, and which terminates into any high impedance, should be avoided, as this forms an open stub. The open stub would act as an undesired bandstop filter at a certain frequency of /4 VP (see Sec. 6.2, Distributed Filters ).
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Along with protecting access to the lines on an IOS device, you can also control access to Privilege EXEC mode by assigning a password to it. Two configuration options are shown here:
There is no Program Neighborhood UI control for SpeedScreen Browser Acceleration. SpeedScreen Browser Acceleration settings must be configured in the ICA files. The preferred configuration method is through Web Interface. By default, SpeedScreen Browser Acceleration is enabled on the client for all connections. Note, if either the server or the client has SpeedScreen Browser Acceleration configured to be OFF, then it will be disabled for that connection. This section of the document describes the ICA file parameters that can be used to configure SpeedScreen Browser Acceleration. It is divided into two sections: Basic and Advanced settings. Typically, administrators only need to use the Basic settings.
9,000 5,300 2,700 2,700 2,200
Low Intermediate High
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